Vim muaj cov kev cai "zero-defect" uas nruj zuj zus hauv kev tsim khoom semiconductor, cov hnab looj tes Lijie 9-nti low-chlorine nitrile tau dhau los ua cov khoom siv tiv thaiv tseem ceeb hauv kev ua wafer thiab cov theem ntim chip vim lawv cov ionic residue qis thiab kev ua haujlwm huv siab. Los ntawm kev ua haujlwm tshwj xeeb, cov ntsiab lus chlorine ntawm cov hnab looj tes raug tswj hwm nruj me ntsis ntawm ≤50ppm - ntau tshaj qhov tus qauv kev lag luam ntawm 100ppm. Qhov no tiv thaiv tau zoo rau kev pheej hmoo xeb los ntawm chloride ion migration ntawm cov nplaim wafer, ua tau raws li cov kev cai nruj ntawm kev tsim khoom semiconductor rau kev tswj hwm kev ua qias tuaj me me.
Thaum lub sijhawm ua cov txheej txheem lithography, kev huv ntawm cov hnab looj tes cuam tshuam ncaj qha rau qhov tseeb ntawm cov txheej txheem photoresist thiab cov txiaj ntsig raug. Tsim tawm hauv Chav Kawm 100,000 chav huv thiab raug tshem tawm cov hmoov av laser, cov khoom no qhia txog qhov tso tawm ntawm cov khoom me me hauv qab 0.2 cov khoom me me / square inch - ua tau raws li ISO Class 3 chav huv. Qhov no tiv thaiv cov khoom me me lo rau ntawm cov nplaim wafer, yog li txo cov teeb meem lithography. Tus qauv ntev 9-nti muab kev npog tag nrho los ntawm dab teg mus rau xib teg. Ua ke nrog cov qauv cuff elastic, nws ua kom muaj kev ywj pheej ua haujlwm thaum tiv thaiv cov hmoov av tawm ntawm qhov qhib tes tsho, ua tau raws li cov kev cai nruj rau cov chaw huv si hauv cov txheej txheem lithography.
Thaum lub sijhawm ua cov txheej txheem uas muaj cov tshuaj reagents corrosive heev xws li etching thiab ion implantation, cov hnab looj tes no qhia tau tias lawv tiv taus tshuaj lom neeg zoo heev. Tom qab sim 24 teev hauv cov tshuaj reagents semiconductor xws li hydrofluoric acid thiab phosphoric acid, lawv tsis muaj o lossis tawg, nrog rau qhov hnyav hloov pauv qis dua 0.8%. Qhov no muab kev tiv thaiv tes zoo rau cov neeg ua haujlwm thaum tshem tawm cov kev pheej hmoo ntawm kev ua qias tuaj ntawm cov tshuaj reagents los ntawm kev puas tsuaj ntawm hnab looj tes. Cov ntiv tes muaj cov qauv tiv thaiv kev plam 0.02mm laser-engraved, ua rau muaj kev sib txhuam ntau dua 35% thaum tuav 12-nti wafers thiab txo qhov kev pheej hmoo ntawm wafer slippage los ntawm 60%. Qhov no ua tiav qhov sib npaug ntawm kev nyab xeeb tiv thaiv thiab kev ruaj khov ua haujlwm.
Tam sim no tau ntawv pov thawj rau SEMI F57 cov qauv, cov hnab looj tes no tau muab tso rau hauv cov kab ntau lawm ntawm cov chaw tsim khoom loj xws li SMIC thiab Hua Hong Semiconductor. Lawv txo cov nqi pov tseg wafer los ntawm kev sib cuag tes los ntawm 38%, tsim lawv tus kheej ua qhov kev xaiv zoo tshaj plaws hauv kev tsim khoom semiconductor rau kev sib npaug ntawm kev tiv thaiv chav huv nrog kev ua haujlwm zoo.
Lub sijhawm tshaj tawm: Kaum Ib Hlis-11-2025